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Photonic System Packaging Roadmap

Dr. Wilmer R. Bottoms, Third Millenium Test Solutions, Inc.

At the leading edge everything will change to allow high reliability
System in Package products meeting market needs at low cost.

This requires:

  • New design and simulation tools
  • New materials
  • New device designs and architectures
  • New package architectures
  • New network architectures
  • New manufacturing processes

Register

Registration password is mphcmit