TEST, ASSEMBLY AND PACKAGING

AIM Photonics’ TAP facility is the nation’s first accessible 300 mm state-of-the-art facility for integrated silicon photonics test, assembly, and packaging.

Our development and production process capabilities in wafer-scale, chip-scale and I/O attach also include advanced test and metrology capabilities for each of these key functions.

We work closely with the AIM Photonics Multi-Project Wafer team at Albany Nanotech to help you design, build and package your photonic integrated circuit prototypes. In addition, we also provide test, assembly and packaging services for customer-provided chips and wafers.

Our extensive toolset offers advanced capabilities for fiber attach, heterogeneous integration, and metrology and testing of photonic and electronic devices. This—combined with our deep industry expertise—uniquely positions us to provide individualized service to meet our customers’ needs. Whether your job consists of a single device or multiple wafers, we’re ready to help with your prototype development, test and metrology requirements.

We offer a flexible pricing structure, including hourly, project-based, and collaborative partnership options. Contact us today for more information.

Contact Us

Chris Striemer
Director of Test, Assembly and Packaging Operations
CStriemer@sunypoly.edu

Our Services

Assembly and Packaging

image of wire bonding at AIM Photonics' Test, Assembly and Packaging facility

We provide advanced wafer-level and die-level assembly and packaging services for both AIM Photonics’ multi-project wafers as well as customer-provided wafers and chips. Capabilities include:

  • Fiber Attach - single mode fiber, fiber arrays, PM fiber and active alignment

  • Flip Chip (photonic and electronic) - thermal, sonic and compression and placement within 0.5 µm tolerance

  • Wafer Probing - optical/RF/DC

  • Dicing - standard thickness wafers 775 µm, thin wafers ~100 µm, dicing street ≥ 100 µm mechanical and ~10-15 µm plasma and laser

  • Die Attach - conductive and/or non-conductive adhesives

  • Wire Bonding - ~100 µm pitch with 1 mil wire and ~150 µm pitch with 2 mil wire

  • Metallization - plating: Cu, SnAG, PD, Ni, Au and sputtering: Ti, TiW, Cu, NiV, Ni

  • Bumping - depending on aspect ratio, >75 µm pitch; <75 µm is on the roadmap

  • Heterogeneous Integration

    • Electronic Photonic Interposers - Silicon chip carriers and full interposers with TSVs

    • Wafer-to-Wafer Bonding - Oxide fusion bonding, hybrid bonding, temporary bonding

Opto-Electronic Test

opto-electronic test tool in AIM Photonics' Test, Assembly, and Packaging facility

Our extensive opto-electronic measurement capabilities allow you to invest your valuable resources in technology development and leave the testing to us. We offer comprehensive on-wafer, die-level, and packaged-device testing services for both photonic and electronic devices. Capabilities include:

  • Passive Optical - insertion loss, propagation loss, spectral, group index/velocity

  • Active Optoelectronic - modulation (Vπ L), detector responsivity, laser LIV

  • Telecom/Datacom - eye-diagram, optical modulator and photodiode bit error rate testing

  • RF - S-parameters, detector bandwidth

  • DC - DC IV, leakage current measurements using a multi-contact DC probes

Metrology

workers using metrology tools in AIM Photonics' Test, Assembly, and Packaging facility

As with conventional semiconductor manufacturing processes, metrology and inspection are equally critical steps in the development and manufacturing of photonic integrated circuits. We have a full suite of metrology tools to identify defects and help ensure quality control. Capabilities include:

  • Ellipsometry

  • Reflectrometry

  • Spectroscopy

  • Profilometry

  • SEM

  • X-Ray

  • IR

  • Acoustic microscopy