AIM Photonics Multi Project Wafers (MPW) 

2018 MPW Fab Runs:  SUNY Poly 300mm Fab

3 MPW offerings

  • Full-Active:    3 runs in 2018 and 2019
  • Passive:         3 runs in 2018 and 2019
  • Interposer:     1 run   in 2018 and 2019

MOSIS is the MPW Aggregator

  • DRC clean designs (with Mentor Calibre) are submitted to MOSIS
  • MOSIS also distributes the PDK

MPW Pricing (minimum 20 unpackaged die)

Die dimensions nominally 6mm x 8.5mm for Active or Passive riders or 1.9mm x 4.2mm for Active only riders. Interposer die dimension nominally 12mm x 13mm.

FULL (Active) 51mm2 chips

  • $100K AIM members
  • $120K non-members

FULL (Active) 7.7mm2 chips

  • $25K AIM members
  • $30K non-members

PASSIVE 51mm2 chips

  • $30K AIM members
  • $36K non-members

INTERPOSER 156mm2 chips

  • $93.6K AIM members
  • $112.3K non-members