ACTIVE INTERPOSER

The active interposer is an extension of our active PIC technology. Here, the photonics wafer is flipped and bonded to a handle wafer before additional processing for electronic and photonics I/O. After flipping, the interposer can be used to create trenches for laser chips to be soldered in.

Alternatively, waveguides can be selectively exposed for heterogeneous integration of exotic materials, or the terminal metal can be bumped for flip chip of CMOS driver chips.

We utilize advanced waveguide fabrication methods that improve silicon waveguide propagation loss to < 0.5 dB/cm while the silicon nitride waveguide propagation loss is < 0.35 dB/cm.

Design Information

The active interposer PDK is scheduled to be released in Q4/2023.

The active interposer is supported by the component library from Analog Photonics (APSUNY). The APSUNY library is a comprehensive, high-performance, black box library focused on operation in the O, C, and L bands.

Customization

While we typically follow a standard process flow that designers cannot modify, AIM Photonics has developed a “bite-size” custom offering in which designers can make minor changes to the process flow for an additional fee. This is not a full custom run, and the modification must be something the fab team can execute without additional development work.

Please contact us well in advance of the design due date to ensure that our team understands your request and can properly quote the work.

Customization Options Currently Available for Active Interposers

• Adjust ridge depth

• Adjust waveguide thicknesses

• Adjust vertical spacing between waveguides

• Trench to the waveguides with or without expose

• Extra/custom implants

• Custom laser trench