MULTI-PROJECT WAFER (MPW) AND TEST, ASSEMBLY AND PACKAGING (TAP) AGREEMENTS

Working with AIM Photonics to purchase wafer fabrication or test, assembly and packaging services involves the disclosure of confidential information, therefore the first step is to enter into an agreement which covers the terms and conditions surrounding this disclosure.

Once this requirement is met, then we’ll need two more things:

  1. A services agreement that sets the terms and conditions for payment and delivery of your hardware. The fully executed services agreement is required before we can reserve your space on an MPW run or a private run, or provide test, assembly and packaging services.

  2. An export control form, which is required to meet U.S. export control regulations.

To initiate the process for prototyping and/or test, assembly and packaging services, please submit a request.

Agreements for AIM Photonics services are executed through the Research Foundation for the State University of New York on behalf of The SUNY Polytechnic Institute. This is the organization who is responsible for the administrative management of AIM Photonics.