ASSEMBLY DESIGN KIT (ADK)

AIM Photonics’ Assembly Design Kit (ADK) integrates packaging considerations into photonics design workflows, enabling chip-package co-design. It includes templates, models and simulation tools that help align photonic integrated circuit designs with AIM Photonics' packaging and assembly processes during early design stages.

Current Version:

The current version to use with AIM Photonics’ MPW runs is 0.6

Supported Packaging Configurations

  • Wirebond

  • Fiber attach

Design Integration and Enablement

  • Integration with current PIC layout workflows

  • Parametric cells (P Cells) to ensure compatibility with packaging processes

  • Design templates and verified simulation data

Supporting Design Assets

  • 3D models

  • PCB design files

Supported EPDA Design Tools

  • Cadence (for PC boards)

  • GDSFactory

  • KLayout

  • Luceda

Future Releases (in development):

Additional Packaging Approaches

  • Flip-chip

  • AIM Photonics electronic interposer-based packaging design

  • Photonic wirebond support

  • Microlenses

Advanced Design and Simulation Capabilities

  • RF board-level enablement (RF boards for flip-chip and interposer)

  • Thermal and RF assembly simulation

REQUEST ADK ACCESS

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