AIM Photonics Executive Director Wade Cook will attend the New York State Innovation Summit, a multi-day event for NYS organizations that want to showcase and discover new and emerging technologies that support innovation and drive business growth, on October 29.

Join AIM Photonics Chief Operating Officer Dr. David Harame at the Frontiers in Optics + Laser Science (FiO LS) Conference in Denver, Colorado, where he will present his talk, “Heterogeneous Photonic-Electronic Platform with Slow-Wave Mach-Zehnder Modulator for High Bandwidth-Density Co-Packaged Optics.”

AIM Photonics will exhibit at the upcoming 36th Annual Electronics Packaging Symposium at the GE Aerospace Research Center in Niskayuna, NY. AIM Photonics Chief Operating Officer will discuss co-packaged optics during a presentation and panel on Wednesday, September 3. The event focuses on various aspects of electronic packaging and how advanced packaging is evolving toward a Chiplet future.

AIM Photonics Executive Director Wade Cook is the Keynote Speaker at the IEEE Research and Applications of Photonics in Defense (RAPID) Conference. Wade will present, “AIM Photonics Manufacturing Institute: Accessible, Domestic 300mm Silicon Photonics PICs and Packaging for Prototyping and Product Development.”

AIM Photonics will be featured at SPIE Optics + Photonics, taking place August 3-7, 2025, in San Diego, CA. Don’t miss our presentations, where we’ll share the latest on design enablement solutions for 300 mm silicon photonics, hybrid integrated lasers in a silicon photonics process, and PIC-focused education and workforce development.

Join us at the AIM Photonics Summer Academy for a week of intensive study in integrated photonics, including materials, devices, circuit design and chip fabrication principles, packaging, sustainability, testing, system applications, and introduction to electronic-photonic design automation (EPDA) software.

Four days of hands-on activities at AIM Photonics’ Test, Assembly and Packaging (TAP) Facility, Rochester Institute of Technology, and University of Rochester that will teach you how to test, analyze, and package photonic integrated circuits.

AIM Photonics Chief Operations Officer David Harame will present on Silicon Photonics Manufacturing: Customer Requirements and Fab Readiness at the Optica Advanced Photonics Congress in Marseille, France.

Our 2025 Members Meeting will be held at the University of Rochester Institute of Optics on June 10-11.

For the 2025 meeting, we are expanding the event to two days, giving you more time to connect, collaborate, and exchange ideas with fellow members.

AIM Photonics Chief Operating Officer David Harame will chair the Accelerating Prototype to Commercial Manufacturing Workshop during the Integrated Photonic System Roadmap (IPSR-International) 2025 Spring Meeting on Friday, June 6, 2025, at 10:20 a.m.

Join us in Dallas, Texas for the 2025 IEEE 75th Electronic Components and Technology Conference (ECTC). Stop by our exhibit booth (#134) to learn how AIM Photonics can help you build and package your photonic integrated circuit prototypes.

Join AIM Photonics Process Integration Engineer Dr. Soumen Kar at the Advanced Semiconductor Manufacturing Conference (ASMC) in Albany, New York. Dr. Kar will present on “Compositional Analysis of Thick Silicon Nitride Films Using X-ray Photoelectron Spectroscopy.”

Nathan Lin, Director of Photonics Outreach at AIM Photonics, is slated to deliver a presentation titled "Electronic Interposer Platform for 2.5D Heterogeneous Integration of Photonics-Electronics Chiplet Systems" at this year's CLEO event in Long Beach, California. If you’re attending the event, make sure to stop by to learn more.

AIM Photonics’ Executive Director Wade Cook will join the High-Performance Computing: AI, Optical, and Quantum panel on April 30 at the CHIPS NORTH Executive Summit. The CHIPS NORTH Executive Summit, presented by Canada’s Semiconductor Council brings together top executives, policymakers, and innovators from Canada, the U.S., and key global markets on a premier platform to share insights, set priorities, and forge partnerships that will advance Canada's role in the global semiconductor value chain.

Join us in San Francisco, CA, for OFC 2025 and stop by our exhibit booth (#6049) during the conference to learn about how we assist businesses in propelling their inventive concepts into production-ready prototypes through our design enablement, multi-project wafer, and electronic-photonic test, assembly, and packaging services.

Four days of hands-on activities at AIM Photonics’ Test, Assembly and Packaging (TAP) Facility, Rochester Institute of Technology, and University of Rochester that will teach you how to test, analyze, and package photonic integrated circuits.

AIM Photonics is excited to exhibit and present at the upcoming SPIE Photonics West. Stop by our booth (#233) to engage with our team of experts who can speak to you about how AIM Photonics’ design enablement, multi-project wafer, and electronic-photonic test, assembly and packaging capabilities can help you take your ideas from creative concepts into production-ready prototypes.

AIM Photonics will be at the Defense Manufacturing Conference (DMC) 2024 in Austin, Texas, December 2-5. Members of our technical staff will be at our exhibit booth (#432) to answer questions and show how AIM Photonics is growing the integrated photonics ecosystem in the U.S. to help secure our country’s national defense and economic priorities.

AIM Photonics Chief Operating Officer will present at the University of Pittsburgh Infrastructure Sensing Collaboration (UPISC) Workshop on November 13, 2024 at 2 p.m. Dr. Harame is an Invited Industry Speaker at the event and will present on AIM Photonics and On-Chip Photonics Manufacturing and Design.

Join AIM Photonics AIM Photonics Director of Outreach Dr. Nathan Lin and Research and Development Engineer Dr. Mohammad Rakib Uddin at the Frontiers in Optics + Laser Science (FiO LS) in Denver, Colorado. Dr. Uddin will present on “A Vertical-Junction Carrier-Depletion Micro-Ring Modulator,” and Dr. Lin will act as a presiding chair and technical program committee member.

AIM Photonics will exhibit at the upcoming 35th Annual Electronics Packaging Symposium at Binghamton University’s Innovative Technologies Complex. The schedule features a talk by Colin McDonough, 3D and Heterogeneous Integration Manager.