Join AIM Photonics at the PIC International Conference in Brussels, Belgium, as AIM Photonics Chief Operations Officer David Harame presents AIM Photonics end-to-end silicon manufacturing services.

Join us in San Diego, CA, for OFC 2024 as experts from AIM Photonics lead the Show Floor Session, “AIM Photonics Presents PICs, Heterogeneous Integration, and Packaging for Next-Generation Silicon Photonic Applications” on Thursday, March 28. Make sure to also stop by our exhibit booth (#4402) during the conference to learn about how we assist businesses in propelling their inventive concepts into production-ready prototypes through our design enablement, multi-project wafer, and electronic-photonic test, assembly, and packaging services.

Join AIM Photonics at GOMACTech 2024 in Charleston, SC, as AIM Photonics Chief Operations Officer David Harame presents on “Hetrero-Epitaxial Quantum Dot Laser Integration On Silicon (HELIOS).” The GOMACTech conference was established primarily to review developments in microcircuit applications for government systems.

Three days of hands-on activities at AIM Photonics’ Test, Assembly and Packaging (TAP) Facility, Rochester Institute of Technology, and University of Rochester that will teach you how to test, analyze, and package photonic integrated circuits.

AIM Photonics is excited to exhibit at the upcoming SPIE Photonics West. Stop by our booth (#241) to engage with our team of experts who can speak to you about how AIM Photonics’ design enablement, multi-project wafer, and electronic-photonic test, assembly and packaging capabilities can help you take your ideas from creative concepts into production-ready prototypes.

The AIM Photonics Boot Camp covers key concepts and provides hands-on training using state-of-the-art tools at the Labs for Education and Application Prototypes (LEAP) at MIT and Bridgewater State University. This event is not strictly a lecture format, focusing instead on a combination of hands-on, problem-based learning methods to create a skilled workforce of independent thinkers who can meet the practical challenges they will face in the workplace.

Join us at the Defense Manufacturing Conference (DMC) 2023 in Nashville, Tennessee, December 11-14. Members of our technical staff will be at our exhibit booth (#230) to answer questions and show how AIM Photonics is growing the integrated photonics ecosystem in the U.S. to help secure our country’s national defense and economic priorities.

AIM Photonics’ Electronic Photonic Design Automation (EPDA) Engineer Jobayer Hossain will present “Compact Modeling of Key Passive Silicon Components for a Process Design Kit” and “Bilayer Silicon Nitride Based On-Chip Polarization Rotator for O-Band Photonic Applications” at the IEEE Photonics Conference Welcome Reception and Poster Session on November 12 from 6 to 8 p.m.

AIM Photonics Chief Operations Officer David Harame will attend the Microelectronics Commons Annual Meeting in Washington, D.C., October 17-18, 2023. Designed to foster continued collaboration throughout the microelectronics community, the Microelectronics Commons empowers commercial leaders to guide the DoD’s efforts in microelectronics development.

AIM Photonics Executive Director Wade Cook and Director of Technology Delivery Chandra Cotter will attend the New York State Innovation Summit, a multi-day event for NYS organizations that want to showcase and discover new and emerging technologies that support innovation and drive business growth.

AIM Photonics’ Electronic Photonic Design Automation (EPDA) Engineer Jobayer Hossain will present a compact modeling methodology for ring resonators used for sensors technology fabrication in AIM Photonics multi-project wafer (MPW) runs at the FiO LS Conference on October 11. This methodology—which builds compact models of the high-Q ring resonators working within the CL, O, YJ and IZ bands, in both TE and TM polarization—was developed based on measured data and is compatible with most standard EPDA tools.

Join AIM Photonics at ECOC 2023 in Glasgow, Scotland, as AIM Photonics Chief Operations Officer David Harame presents on “Packaging and Foundry Services at AIM Photonics.” David will present during the “Th.A.2 Special Session – PIC Packaging and Integration” at 8:30 a.m. on Thursday, October 5.

AIM Photonics will exhibit and present at the upcoming Electronics Packaging Symposium at the Albany Nanotech Complex. The schedule features a talk by Colin McDonough, 3D and Heterogeneous Integration Manager, on AIM Photonics’ photonic interposer technologies, and a panel discussion featuring Bob Geer, Director of Education and Workforce Development, on “Workforce Development Challenges - Supporting the CHIPS and Science Act.”

AIM Photonics’ Executive Director Wade Cook will attend the NDIA Emerging Technologies Conference to share how integrated photonics technology developed by AIM Photonics is critical to national defense. Stop by the DoD Manufacturing Technology Program booth #703 to learn more about AIM Photonics.