David Harame
Introduction to AIM Photonics and NY Creates PICs and Packaging Capabilities
Friday, February 6, 12 p.m.
Online Event
This presentation will provide an overview of the Photonic and Packaging Capabilities of NY Creates and AIM Photonics.
AIM Photonics, a Department of Defense (DoD) Manufacturing Innovation Institute (MII), offers end-to-end services in photonic integrated circuits (PICs), interposers, heterogeneous integration (HI), electronic photonic design automation (EPDA), and packaging. AIM Photonics leverages the world-class 300 mm NY Creates’ Albany NanoTech Complex, which houses the Center for Semiconductor Research, CMOS Fabrication, Heterogeneous Integration, and High NA EUV Centers. The Institute’s PIC technologies include a full-featured CLO Silicon Photonics (SiPh) base technology, quantum-optimized SiPh, SiN-only for sensors and other applications, and base SiPh with III-V quantum dot lasers providing a broad set of PICs across all the major photonic application areas. 300 mm electronic-photonic interposers provide a unique platform for large-area packaging substrates with SiPh and waveguides. The NY Creates HI center provides dense interconnects, including C4, C2, Cu-Cu, wafer, and die-to-wafer hybrid bonding and advanced packaging build capabilities, including wafer and chip-level assembly and packaging. EPDA, process design kits, and assembly design kits enable design across all PIC, interposer, and packaging offerings.
Another challenge is building a skilled workforce for the industry. This talk will also share an overview of AIM Photonics and NY Creates education and workforce development programs, including online and hands-on offerings.