AIM Photonics will exhibit and present at the upcoming 36th Annual Electronics Packaging Symposium at the GE Aerospace Research Center in Niskayuna, NY. AIM Photonics Chief Operating Officer will speak on co-packaged optics during a presentation and panel discussion on Wednesday, September 3. The event focuses on various aspects of electronic packaging and how advanced packaging is evolving toward a Chiplet future.
David Harame
Co-Process and Co-Design for Co-Packaged Optics Wednesday, September 3, 1-1:30 p.m.
Panelist for Co-Packaged Optics, Challenges and Adoption Wednesday, September 3, 3-4:30 p.m.
