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Colin McDonough, 3D and Heterogeneous Integration Manager at AIM Photonics, is slated to deliver a presentation titled "Electronic-Photonic Packaging for Si Photonics" at the iMAPS New England 51st Symposium & Expo. If you’re attending the event, make sure to stop by to learn more.
Colin McDonough
Electronic-Photonic Packaging for Si Photonics
Session H: Photonics Packaging
May 6, 1 p.m.
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