Join us in Los Angeles, CA, for OFC 2026 and visit our exhibit booth (#5218) during the conference to learn about how we assist businesses in propelling their inventive concepts into production-ready prototypes through our design enablement, multi-project wafer, and electronic-photonic test, assembly, and packaging services.

AIM Photonics Presents PICs, Heterogeneous Integration & Packaging for Next-Gen Integrated Photonics

Date: Wednesday, March 18
Time: 1:15-2:15 p.m.
Location: Theater II, Los Angeles Convention Center

Session Description:

As silicon photonics applications continue to expand, many teams face a familiar challenge: moving promising ideas into reliable, testable prototypes. Barriers related to design maturity, fabrication access, and packaging and test infrastructure can slow progress and limit who can participate.

This floor talk brings together industry and research perspectives to examine how key barriers are being addressed and what it takes to translate PIC concepts into working hardware. Speakers will discuss emerging technology trends, practical considerations in prototype development and how current capabilities are supporting new applications, including sensing and quantum technologies.

Panelists:

John Bowers

Director of the Institute for Energy Efficiency, University of California, Santa Barbara, United States
Trends in PIC technology and perspective on the future of silicon photonics and electronics

David Harame

Chief Operating Officer, AIM Photonics, United States
PIC prototype development using AIM Photonics multi-project wafer (MPW) and test, assembly, and packaging capabilities

Todd Stievater

United States Naval Research Laboratory, Head, Integrated Nanophotonics Section, Optical Sciences Division
PIC Technology for Sensors and Quantum