Join AIM Photonics at the PIC International and AP International Conferences in Brussels, Belgium, as AIM Photonics Chief Operations Officer David Harame presents AIM Photonics’ end-to-end capabilities in photonic integrated circuits, interposers, heterogeneous integration, EPDA, and advanced packaging, enabled by the 300 mm NY Creates’ Albany NanoTech Complex.

David Harame

AP International
Tuesday, April 21, 2026, 2:40 p.m.
Session: Manufacturing & Pilot Lines
Assembly Design Kit Challenges and Opportunities

PIC International
Wednesday, April 22, 9:45 a.m.
Session: Future computing: PICs for photonic processing, quantum computers, and neural networks
AIM Photonics / NY Creates PIC and Packaging Foundry for an End-to-End Approach to the Challenges in Photonic Integrated Circuits (PIC) and Packaging

Assembly Design Kit Challenges and Opportunities
We are in an exciting era of silicon photonics technology and packaging, where photonic integrated circuits (PICs) are heterogeneously assembled with both electronic integrated circuits (EICs) and a broad range of optical components. Packaging technologies such as micro-transfer printing enable the integration of III–V lasers, amplifiers, and high-speed modulators, with optical connectivity provided by printed microlenses and photonic wire bonds. In parallel, hybrid bonding and through-silicon vias are enabling dense 3D EIC–PIC integration.

To capitalize on these advances at the system level, designers need standardized assembly data, rules, and models that capture both the physical and behavioral views of the interfaces across domains. The AIM Photonics’ Assembly Design Kit (ADK) provides this enablement through layout automation, design rules, electrical and optical models, simulation workflows, and prototype boards. By integrating the ADK with the AIM Photonics design PDK, we create a seamless path from PIC design to packaged prototypes. Our goal is to make advanced packaging accessible to a broader design community and accelerate system innovation for next-generation applications.

AIM Photonics / NY Creates PIC and Packaging Foundry for an End-to-End Approach to the Challenges in Photonic Integrated Circuits (PIC) and Packaging
AIM Photonics, a Department of Defense (DoD) Manufacturing Innovation Institute (MII), offers end-to-end services in photonic integrated circuits (PICs), interposers, heterogeneous integration (HI), electronic photonic design automation (EPDA), and packaging. AIM Photonics leverages the world-class 300 mm NY Creates’ Albany NanoTech Complex, which houses the Center for Semiconductor Research, CMOS Fabrication, Heterogeneous Integration, and High NA EUV Centers. The Institute’s PIC technologies include a full-featured CLO Silicon Photonics (SiPh) base technology, quantum-optimized SiPh, SiN-only for sensors and other applications, and base SiPh with III-V quantum dot lasers providing a broad set of PICs across all the major photonic application areas. 300 mm electronic-photonic interposers provide a unique platform for large-area packaging substrates with SiPh and waveguides. The NY Creates HI center provides dense interconnects, including C4, C2, Cu-Cu, wafer, and die-to-wafer hybrid bonding and advanced packaging build capabilities, including wafer and chip-level assembly and packaging. EPDA, process design kits, and assembly design kits enable design across all PIC, interposer, and packaging offerings. The rapid expansion of AI is driving the development of co-packaged optics (CPO), arguably the most challenging application area in photonic packaging. Addressing the challenges of CPO requires a coordinated development of PIC fabrication processes and packaging technologies. Systems will typically include custom-designed PICs, dense interconnects to electronic integrated circuits, interposers/substrates, lasers, and detachable fiber array units (DFAUs). Having all the parts developed in one foundry and leveraging an advanced 300 mm tool set maximizes the ability to optimize custom designs for CPO. Another challenge is building a skilled workforce for the industry. This talk will share an overview of AIM Photonics and NY Creates education and workforce development programs, including online and hands-on offerings.