Christopher Striemer, Director of TAP Operations at AIM Photonics, will participate in the Advanced Packaging Summit: The Next Frontier in Heterogeneous Integration on June 1, 2026, from 2:15 to 3 p.m. as part of the NY SMART I-Corridor Semiconductor Summit. Representatives from AIM Photonics will also be in attendance, engaging with attendees throughout the event.
The summit will take place on June 1–2, 2026, at the RIT Inn and Conference Center in Rochester, NY, bringing together experts to explore advancements in semiconductor packaging and integration technologies.
