AIM Photonics Showcases Manufacturing Capabilities and Technical Roadmap at OFC 2026
AIM Photonics will bring its manufacturing capabilities and technical roadmap to OFC 2026 from March 15–19 at the Los Angeles Convention Center. The conference provides a forum for AIM Photonics to highlight its unique role in supporting U.S. integrated photonics through shared infrastructure and a manufacturing framework designed to translate research breakthroughs into deployable hardware.
Addressing PIC Development and Manufacturing Challenges
AIM Photonics will sponsor an in-depth OFC Show Floor Talk examining key challenges in PIC development and the translation of breakthrough concepts into real-world hardware for sensing and quantum applications.
“AIM Photonics Presents PICs & Packaging for Co-Packaged Optics and Quantum”
Wednesday, March 18 | 1:15 – 2:15 p.m. | Theater II
The session will provide a roadmap-level view of the manufacturing and infrastructure considerations shaping scalable U.S.-based integrated photonics production and demonstrate how AIM Photonics’ current capabilities align with those needs. The discussion will also underscore the importance of advancing emerging technologies that support national defense priorities while positioning the U.S. integrated photonics industry for long-term leadership. Talks include:
“The Photonics Industry Landscape and How AIM Photonics is Addressing Technical Challenges”
Presented by John Bowers, Director of the Institute for Energy Efficiency at the University of California, Santa Barbara“The AIM Photonics Technical Roadmap in PICs, Heterogeneous Integration, Packaging, and Electronic Photonic Design Automation”
Presented by David Harame, Chief Operating Officer at AIM Photonics“AIM Photonics Visible Platforms for Sensing and Quantum Technologies”
Presented by Todd Stievater, Head of the Integrated Nanophotonics Section, Optical Sciences Division at the U.S. Naval Research Laboratory
Translating PIC Designs into Production-Ready Prototypes
Members of AIM Photonics’ technical staff will be also available throughout the conference to discuss the Institute’s approach to translating photonic integrated circuit designs into production-ready prototypes, supported by its technical capabilities including:
Design enablement and electronic photonic design automation
Multi-project wafer (MPW) runs
Advanced manufacturing, test, assembly and packaging
Heterogeneous integration
Silicon photonics platforms, including active, passive and visible-wavelength technologies for sensing and quantum applications
Education and workforce development
Visit Exhibit Booth #5218 to engage with AIM Photonics’ technical team on design, manufacturing and integration considerations for scalable PIC development.
Exhibit hours are from 10:00 AM–5:00 PM on March 17–18 and 10:00 AM–4:00 PM on March 19.