AIM Photonics Summer Academy’s interactive design project provides direct hands-on learning in real-world PIC design

Join us on June 27 for this online seminar as E. Jan Vardaman, President and Founder of TechSearch International, examines the advantages and challenges of the emerging 3DIC format, laminate substrate format, fan-out on substrate (RDL) format, silicon interposer, and glass substrates.

Immersive academy offers students and industry professionals a full week of intensive short courses and hands-on training on integrated photonic circuit design, chip fabrication, packaging, testing, and system applications.

A three-day integrated photonics bootcamp, held from Mar 22 -24, was organized by the Initiative for Knowledge and Innovation in Manufacturing (IKIM), AIM Photonics, and Bridgewater State University. Lecture topics focused on photonic devices, their applications, and application-specific photonic device packaging challenges.

We’re excited to announce the release of a new process development kit (PDK) developed specifically for advanced photonics applications using silicon nitride (SiN) waveguides. The SiN photonic integrated circuit PDK—which currently consists of the TLX Component Library created in collaboration with U.S. Naval Research Laboratory—was developed for AIM Photonics’ passive, low-loss photonic integrated circuit platform based on SiN waveguide layers for the near-infrared (and soon visible) wavelength ranges.

Researchers from the University of Delaware exposed AIM Photonics’ silicon photonic integrated circuits (PICs) to 11 months of cumulative radiation in low earth orbit; post-flight data shows encouraging results for future use in space applications.