AIM Photonics will attend the 37th Annual Electronics Packaging Symposium, to be held at Binghamton University in Binghamton, NY. The symposium will focus on various aspects of electronic packaging and how advanced packaging is evolving toward a chiplet future. AIM Photonics 3D and Heterogeneous Integration Manager Colin McDonough will co-chair the Photonics Packaging Session on Wednesday, September 9.

Colin McDonough

Co-Chair
Session 2: Photonics Packaging
Wednesday, September 9, 1-2:30 p.m.