AIM Photonics will be presenting at SPIE Optics + Photonics, taking place August 23-27 in San Diego, CA. Join us for our presentation, “Standardizing Silicon Photonics Packaging with Assembly Design Kits,” to learn how assembly design kits (ADKs) are enabling standardized packaging workflows and seamless chip-package co-design for silicon photonics technologies. The presentation will highlight AIM Photonics' packaging platform and recent ADK developments designed to streamline integration, reduce development complexity, and accelerate the path from design to deployment.

Basanth Jagannathan

Standardizing silicon photonics packaging with assembly design kits
Monday, August 24
4:40 - 5:00 p.m. PDT
Conv. Ctr., Room 15A

Abstract

Photonics Assembly Design Kits (ADKs) are presented as a means to standardize advanced PIC packaging technologies and design flows, enabling seamless chip-package co-design in much the same way that foundry Process Design Kits (PDKs) enable frictionless design in a silicon foundry. AIM Photonics offers a rich suite of PDK solutions for its 300 mm silicon foundry, and ADKs aim to extend this capability to packaging and assembly services. This work introduces AIM Photonics’ packaging platform and ADK for 300 mm silicon photonics technologies. Recent ADK releases are highlighted, including design templates for CL- and O-band fiber attach, wire bonding, and RF board design enablement. Additional support for flip-chip integration, interposer layout templates, lasers, photonic wire bonding, and microlenses, complemented by thermal and RF simulation, will also be discussed.