AIM Photonics at Photonics West 2026
Experts to share practical perspectives on silicon photonics fabrication, testing and education initiatives
Join us as technologists from AIM Photonics highlight recent technology advancements in silicon photonics at SPIE Photonics West, taking place Jan. 17–22, 2026 in San Francisco, California.
In addition to the highlighted talks below, be sure to visit our exhibit booth (#241) for a live demonstration of AIM Photonics’ Hands-on Photonics Education (HOPE) Kit, a set of integrated photonics chips designed to help students at U.S. colleges and universities gain practical experience with photonic integrated circuits (PICs) through hands-on testing and characterization.
Members of our technical staff will also be available at our booth throughout the conference to explain how AIM Photonics can help advance your company’s innovative ideas into manufacturing-ready prototypes using our design enablement, multi-project wafer and electronic-photonic test, assembly and packaging services.
This year the Institute is also collaborating with our members exhibiting at the conference to show how working together advances the U.S. integrated photonics industry.
Aeluma - Booth 133
Ansys (Synopsys)- Booth 349
Canadian Photonics Fabrication Centre (CPFC) - Booth 4620
EXFO - Booth 5317
Flexcompute - Booth 4338
Freedom Photonics - Luminar Semiconductor - Booth 4109
General Dynamics Mission Systems - Booth 673
Hamamatsu - Booth 1127
Kyocera International, Inc. - Booth 4738
L3Harris Technologies, Inc. - Booths 1727 & 8210(Bios Expo)
New York Photonics - Booth 239
Spark Photonics / Luceda - Booth 5313
The Institute of Optics, University of Rochester - Booths 245 and 8669
Technical Presentations
Mark your calendars for these technical presentations from AIM Photonics, where experts will share practical insights drawn directly from the Institute’s work in 300 mm silicon photonics fabrication and testing. Together, these presentations highlight how device design decisions and standardized test methodologies influence real, measured performance in silicon photonics. Attendees will gain insight into both fabrication-level considerations that affect tunable photonic devices and the test and measurement approaches needed to characterize them reliably at wafer and die scale.
Demonstration of all-silicon thermo-optic tunable micro-ring modulator using AIM photonics’ 300 mm process technology
Presented by M. Rakib Uddin
Research and Development Engineer, AIM Photonics
ABSTRACT: We demonstrate an all-silicon thermo-optic tunable micro-ring modulator using AIM Photonics 300 mm process technology. The heater element is placed after the modulator contact regions, and it is about 2 μm apart from the modulator core rib waveguides. A voltage up to 8 V is applied to the heater to thermally tune these devices. The modulator heater performance is tested in terms of resonance shift of the modulators with and without introducing trenches outside of the devices. A non-trenched modulator reported to shift the resonance of approximately 1.7 nm at the applied voltages of 8V while the same applied voltages shifts the resonance of approximately 13.7 nm with the trenched modulator.
19 January 2026 • 11:55 AM - 12:15 PM PST | Room 3018 (Moscone West, Level 3)
Automated and flexible optical and RF test and measurement methodology for CMOS-compatible 300mm silicon photonics technologies
Presented by Anthony Aiello
Photonics and Test Engineer, AIM Photonics
ABSRACT: CMOS-compatible 300mm silicon photonics requires specialized automated electro-optic (EO) probing systems to characterize PIC devices. We present various standardized test methods and alignment routines to carry out passive, DC, and RF EO testing at wafer and die level. Details on required test instrumentation and diagrams are presented with actual measured data from our foundry. Guidelines to layout practices for successful test are also presented.
21 January 2026 • 6:00 PM - 8:00 PM PST | Poster Hall (Moscone West, Level 2)