Chip-Package Co-Design with AIM Photonics’ Assembly Design Kit
This episode of Photonics in Focus features a conversation with Amit Dikshit, Design Enablement Manager, Basanth Jagannathan, Design Enablement Engineer, and Chris Striemer, Director of Test, Assembly and Packaging Operations at AIM Photonics, who discuss the Institute’s recently released Assembly Design Kit (ADK) and its role in supporting chip-package co-design workflows for photonic integrated circuits.
The discussion explores why packaging considerations are becoming increasingly important earlier in the PIC design process and how disconnects between design and packaging can lead to redesigns, delays and workflow inefficiencies. Dikshit, Striemer and Jagannathan explain how the ADK was developed to help designers better align PIC layouts with assembly and packaging approaches from the beginning of development rather than later in the process.
The episode also provides an overview of the current ADK release, including the templates, models and workflow resources now available to designers. Drawing on perspectives from both design enablement and packaging operations, the guests discuss how the ADK fits into existing design workflows, where it can have the greatest impact and how earlier coordination between design and packaging teams can help improve manufacturability, reduce iteration cycles and support more efficient photonics development workflows.