ACTIVE PIC CHIP CARRIER
The Chip Carrier offering is an extension of our active PIC technology. Here, the photonics wafer is flipped and bonded to a handle wafer before additional processing for electronic and photonics I/O. After flipping, the chip carrier can be used to create trenches for laser chips to be soldered in. Alternatively, waveguides can be selectively exposed for heterogeneous integration of exotic materials, or the terminal metal can be bumped for flip chip of CMOS driver chips.
The photonics portion of our Active PIC Chip Carrier offering utilizes advanced waveguide fabrication methods that improve silicon waveguide propagation loss to < 0.5 dB/cm while the silicon nitride waveguide propagation loss is < 0.35 dB/cm.
The Active PIC Chip Carrier is supported by the component library from Analog Photonics (APSUNY). The APSUNY library is a comprehensive, high-performance, black box library focused on operation in the O, C, and L bands.
Pricing and Schedule
We expect to announce pricing and a run schedule soon. If you would like to be notified when more information is available please subscribe to our mailing list and indicate your interest in “MPW Technology Runs and Updates.”
Customization Available
Adjust ridge depth
Adjust waveguide thicknesses
Adjust vertical spacing between waveguides
Trench to the waveguides with or without expose
Extra/custom implants
Custom laser trench
While MPWs typically follow a standard process flow that designers cannot modify, AIM Photonics has developed a “bite size custom” offering where designers can make minor changes to the process flow for an additional fee. This is not a full custom run, and the modification must be something the fab team can execute without development work.
The fee typically varies between $10,000 - $50,000 depending on exactly what customization(s) are desired.
Please contact us well in advance of the design due date to ensure the fab team understands your request and can properly quote the work.
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